Amkor Technology

Positioning

Second-largest OSAT and the US-based packaging option: a 10-year advanced packaging agreement with TSMC and a CHIPS-funded Arizona campus make it the geopolitical hedge for 2.5D packaging of AI accelerators.

Latest signals

• 21 Oct 2026Nvidia is expanding AI infrastructure manufacturing capacity with six supply-chain partners.Yicai
• 21 Oct 2026Amkor plans to expand advanced-packaging capacity by more than 300% by the end of 2028.36Kr newsflashes
• 11 Sept 2026Amkor expanded its semiconductor manufacturing footprint.Semiconductor Engineering
• 1 Sept 2026Amkor is investing about $7 billion in an advanced-packaging facility near TSMC’s Arizona fabs.EE Times
• 18 Aug 2026Amkor Technology reported record Q2 revenue of $1.90 billion, up 26%.Semiconductor Engineering

24 signals name Amkor Technology. Members see all of them, filtered by topic, source and date.

Facts, with sources

• 18 Aug 2026USD 1900000000Revenue · Semiconductor Engineering
• 1 Dec 2025Package assembly design kit for chiplet package sign-off verificationProduct launch · Semiconductor Engineering
• 5 Sept 2025Lightmatter’s Passage manufacturing ecosystem includes Amkor, ASE, GlobalFoundries, Tower, and TSMCPartnership · Lightmatter
• 10 Feb 2025CHIPS Act award for Arizona advanced packaging plantFunding round · Amkor Q4 2024 call

8 facts on file. Members see all of them with the source link.

Scores, AI Core (of 10)

Traction: deployment, production, commercials, progress. Capability: technology, positioning, firepower, leverage.

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