{"city":"Tempe","name":"Amkor Technology","slug":"amkor-technology","facts":[{"date":"2026-08-18","type":"revenue","value":"USD 1900000000","source":"Semiconductor Engineering"},{"date":"2025-12-01","type":"product_launch","value":"Package assembly design kit for chiplet package sign-off verification","source":"Semiconductor Engineering"},{"date":"2025-09-05","type":"partnership","value":"Lightmatter’s Passage manufacturing ecosystem includes Amkor, ASE, GlobalFoundries, Tower, and TSMC","source":"Lightmatter"},{"date":"2025-02-10","type":"funding_round","value":"CHIPS Act award for Arizona advanced packaging plant","source":"Amkor Q4 2024 call"}],"peers":[],"stage":null,"state":"Arizona","aliases":["Amkor"],"country":"United States","domains":[{"why":"Amkor provides semiconductor packaging and test services and is expanding advanced-packaging capacity, including a planned $7 billion Arizona advanced-packaging and test campus.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":72,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":8,"position":6,"progress":9,"firepower":8,"commercial":10,"deployment":6,"production":8,"technology":6},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-10-21","header":"Nvidia is expanding AI infrastructure manufacturing capacity with six supply-chain partners.","outlet":"Yicai"},{"date":"2026-10-21","header":"Amkor plans to expand advanced-packaging capacity by more than 300% by the end of 2028.","outlet":"36Kr newsflashes"},{"date":"2026-09-11","header":"Amkor expanded its semiconductor manufacturing footprint.","outlet":"Semiconductor Engineering"},{"date":"2026-09-01","header":"Amkor is investing about $7 billion in an advanced-packaging facility near TSMC’s Arizona fabs.","outlet":"EE Times"},{"date":"2026-08-18","header":"Amkor Technology reported record Q2 revenue of $1.90 billion, up 26%.","outlet":"Semiconductor Engineering"},{"date":"2026-08-05","header":"NVIDIA plans to produce up to $500 billion of AI infrastructure in the U.S. with partners.","outlet":"NVIDIA blogs"}],"website":"amkor.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-25T23:16:48.240585+00:00","facts_total":8,"positioning":"Second-largest OSAT and the US-based packaging option: a 10-year advanced packaging agreement with TSMC and a CHIPS-funded Arizona campus make it the geopolitical hedge for 2.5D packaging of AI accelerators.","sub_category":"Advanced packaging","signals_total":24,"url":"https://www.frontiertechintelligence.com/companies/amkor-technology","title":"Amkor Technology · ai core, Tempe, Arizona, United States · scores, facts and signals · Frontier Tech Intelligence","description":"Amkor provides semiconductor packaging and test services and is expanding advanced-packaging capacity, including a planned $7 billion Arizona advanced-packaging and test campus. AI Core watchlist (score 72) 24 signals and 8 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}