{"city":"Kaohsiung","name":"ASE Technology","slug":"ase-technology","facts":[{"date":"2026-09-01","type":"revenue_band","value":">500m","source":"EE Times"},{"date":"2026-08-18","type":"revenue","value":"USD 6050000000","source":"Semiconductor Engineering"},{"date":"2026-02-01","type":"revenue","value":"USD 3200000000","source":"EE Times"},{"date":"2025-10-31","type":"revenue","value":"USD 1000000000","source":"DigiTimes"},{"date":"2025-09-19","type":"product_launch","value":"Celestial plans to provide optical chiplets and packaging technology to chip designers.","source":"EE Times"},{"date":"2025-04-16","type":"partnership","value":"ASE is establishing a shared database and cross-group coordination process for silicon photonics development.","source":"semiconductor-today.com"}],"peers":[],"stage":null,"state":"Kaohsiung","aliases":["Advanced Semiconductor Engineering","ASE","ASEH","FOCoS","日月光投控"],"country":"Taiwan","domains":[{"why":"ASE Technology provides semiconductor assembly, test and advanced packaging, including a fan-out RDL platform, and is developing packaging for optical chiplets.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":80,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":8,"position":8,"progress":9,"firepower":8,"commercial":10,"deployment":8,"production":10,"technology":6},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-09-01","header":"ASE Technology has budgeted a record $10.5 billion for expansion, including advanced packaging in Asia.","outlet":"EE Times"},{"date":"2026-08-18","header":"ASE Technology reported Q2 2026 revenue of $6.05 billion, up 26.7%.","outlet":"Semiconductor Engineering"},{"date":"2026-07-24","header":"ASE, PTI, Amkor, TSMC, SK hynix, Ibiden, and Unimicron are expanding advanced-packaging capacity.","outlet":"Electronics Weekly"},{"date":"2026-05-21","header":"ASE expects its advanced-packaging sales to double this year.","outlet":"EE Times"},{"date":"2026-05-21","header":"AMD is developing next-generation 2.5D bridge interconnect technology with ASE and SPIL.","outlet":"EE Times"},{"date":"2026-05-21","header":"Intel-led researchers published a heterogeneous-integration perspective in Nature Reviews Electrical Engineering.","outlet":"Semiconductor Engineering"}],"website":"aseglobal.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-25T23:16:48.240585+00:00","facts_total":8,"positioning":"The world's largest outsourced assembly and test provider and the merchant escape valve when TSMC CoWoS is full: FOCoS bridge packaging, HBM integration and final test for AI accelerators, with Kaohsiung K28 as the expansion site.","sub_category":"Advanced packaging","signals_total":28,"url":"https://www.frontiertechintelligence.com/companies/ase-technology","title":"ASE Technology · ai core, Kaohsiung, Kaohsiung, Taiwan · scores, facts and signals · Frontier Tech Intelligence","description":"ASE Technology provides semiconductor assembly, test and advanced packaging, including a fan-out RDL platform, and is developing packaging for optical chiplets. AI Core watchlist (score 80) 28 signals and 8 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}