ASMPT supplies advanced semiconductor packaging equipment, including thermo-compression bonders and the AMICRA NANO die and flip-chip bonder using hybrid bonding for co-packaged optics.
Assembly and packaging equipment maker (thermo-compression bonding for logic and HBM, photonics and CPO assembly) with 1.6T transceiver tooling orders from the optics supply chain.
26 signals name ASMPT. Members see all of them, filtered by topic, source and date.
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ASMPT supplies advanced semiconductor packaging equipment, including thermo-compression bonders and the AMICRA NANO die and flip-chip bonder using hybrid bonding for co-packaged optics. Assembly and packaging equipment maker (thermo-compression bonding for logic and HBM, photonics and CPO assembly) with 1.6T transceiver tooling orders from the optics supply chain.
ASMPT is on the AI Core watchlist list of Frontier Tech Intelligence with a score of 78 out of 100, below the Top 100.
ASMPT is based in Singapore, Singapore.
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