{"city":"Singapore","name":"ASMPT","slug":"asmpt","facts":[{"date":"2026-09-14","type":"revenue_band","value":">500m","source":"ASMPT"},{"date":"2026-09-14","type":"product_launch","value":"ASMPT bundled digital services centrally for intelligent manufacturing.","source":"ASMPT"},{"date":"2026-09-14","type":"product_launch","value":"ASMPT presented a central data-exchange platform for electronics manufacturing.","source":"ASMPT"},{"date":"2026-09-14","type":"product_launch","value":"ASMPT introduced the fully automatic ALSI LASER1206 laser dicing and grooving system.","source":"ASMPT"},{"date":"2026-09-14","type":"product_launch","value":"ASMPT launched new analytics functions in SMT Analytics.","source":"ASMPT"},{"date":"2026-09-14","type":"partnership","value":"ASMPT and KOKUSAI ELECTRIC joined forces on 2.5D and 3D heterogeneous integration.","source":"ASMPT"}],"peers":[],"stage":null,"state":null,"aliases":["ASM Pacific Technology","0522.HK"],"country":"Singapore","domains":[{"why":"ASMPT supplies advanced semiconductor packaging equipment, including thermo-compression bonders and the AMICRA NANO die and flip-chip bonder using hybrid bonding for co-packaged optics.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":78,"domain":"AI Core","scores":{"gate_ne":["technology","firepower"],"leverage":8,"position":6,"progress":8,"firepower":8,"commercial":9,"deployment":8,"production":8,"technology":8},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-10-28","header":"ASMPT reported record bookings of US$1.13 billion in Q3 2026.","outlet":"Tech in Asia"},{"date":"2026-10-28","header":"ASMPT expects fourth-quarter 2026 revenue of US$670 million to US$730 million.","outlet":"Tech in Asia"},{"date":"2026-09-14","header":"Bassel Haddad became ASMPT’s Group Chief Executive Officer.","outlet":"ASMPT"},{"date":"2026-09-14","header":"Techman Robot and ASMPT signed an MOU to accelerate intelligent-manufacturing innovation.","outlet":"ASMPT"},{"date":"2026-09-14","header":"ASMPT reported strong 2025 third-quarter momentum driven by AI.","outlet":"ASMPT"},{"date":"2026-09-14","header":"ASMPT won orders for 15 additional chip-to-substrate thermo-compression bonding tools.","outlet":"ASMPT"}],"website":"asmpt.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-28T10:01:21.634+00:00","facts_total":11,"positioning":"Assembly and packaging equipment maker (thermo-compression bonding for logic and HBM, photonics and CPO assembly) with 1.6T transceiver tooling orders from the optics supply chain.","sub_category":"Advanced packaging","signals_total":26,"url":"https://www.frontiertechintelligence.com/companies/asmpt","title":"ASMPT · ai core, Singapore, Singapore · scores, facts and signals · Frontier Tech Intelligence","description":"ASMPT supplies advanced semiconductor packaging equipment, including thermo-compression bonders and the AMICRA NANO die and flip-chip bonder using hybrid bonding for co-packaged optics. AI Core watchlist (score 78) 26 signals and 11 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}