{"city":"Duiven","name":"Besi","slug":"besi","facts":[{"date":"2026-08-18","type":"revenue_band","value":">500m","source":"Semiconductor Engineering"},{"date":"2026-08-18","type":"revenue","value":"USD 289000000","source":"Semiconductor Engineering"},{"date":"2026-07-23","type":"customer","value":"hybrid-bonding customers","source":"Besi release, call, Reuters"},{"date":"2026-07-23","type":"revenue","value":"EUR 249900000","source":"Besi release, call, Reuters"},{"date":"2025-12-17","type":"customer","value":"NHanced Semiconductors Inc","source":"semiconductor-today.com"},{"date":"2025-12-17","type":"deployment","value":"Besi Datacon 8800 CHAMEO ultra plus hybrid bonding system","source":"semiconductor-today.com"}],"peers":[{"name":"Disco","rank":14,"slug":"disco","score":"96"},{"name":"Ibiden","rank":40,"slug":"ibiden","score":"91"},{"name":"ASE Technology Holding","rank":42,"slug":"ase-technology-holding","score":"91"},{"name":"Ajinomoto Fine-Techno","rank":64,"slug":"ajinomoto-fine-techno","score":"88"},{"name":"Unimicron","rank":80,"slug":"unimicron","score":"86"},{"name":"Nittobo","rank":86,"slug":"nittobo","score":"85"}],"stage":null,"state":"Gelderland","aliases":["BE Semiconductor Industries","BESI"],"country":"Netherlands","domains":[{"why":"Besi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding.","list":"AI Infra 100","rank":52,"tier":"member","layer":"Fabrication, memory & packaging","total":90,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":10,"position":8,"progress":10,"firepower":8,"commercial":8,"deployment":8,"production":10,"technology":10},"edition":"November 2026","segment":"Advanced packaging"}],"founded":null,"signals":[{"date":"2026-10-02","header":"Applied Materials and Besi expanded collaboration on hybrid bonding and advanced packaging.","outlet":"The Elec"},{"date":"2026-08-18","header":"Besi reported Q2 2026 revenue of $289 million, up 68.7%.","outlet":"Semiconductor Engineering"},{"date":"2026-07-14","header":"Applied Materials and BESI are collaborating on hybrid-bonding process flows.","outlet":"Electronics Weekly"},{"date":"2026-07-14","header":"Hanwha, K&S, and BESI are increasing their exposure to HBM and advanced logic packaging.","outlet":"Electronics Weekly"},{"date":"2025-12-17","header":"NHanced Semiconductors Inc took delivery of a Besi Datacon 8800 CHAMEO ultra plus hybrid bonding system.","outlet":"semiconductor-today.com"},{"date":"2025-12-17","header":"NHanced Semiconductors Inc’s Besi platform provides 200nm die-to-wafer alignment and processes up to 2,000 dies per hour.","outlet":"semiconductor-today.com"}],"website":"besi.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-25T23:16:48.240585+00:00","facts_total":8,"positioning":"The most accurate hybrid-bonding tool maker and a leading assembly-equipment supplier; the equipment bet on HBM4E and co-packaged optics adopting hybrid bonding, with Applied Materials as line partner.","sub_category":"Advanced packaging","signals_total":6,"url":"https://www.frontiertechintelligence.com/companies/besi","title":"Besi · ai core, Duiven, Gelderland, Netherlands · scores, facts and signals · Frontier Tech Intelligence","description":"Besi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding. AI Infra 100 rank 52 (score 90) 6 signals and 8 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}