{"city":"Tokyo","name":"Disco","slug":"disco","facts":[{"date":"2026-07-23","type":"revenue_band","value":">500m","source":"DISCO Q1 presentation"},{"date":"2026-07-23","type":"revenue","value":"FY26 Q1 grinder sales up on gen-AI demand; record consumables; Q2 grinder sales guided +10%","source":"DISCO Q1 presentation"},{"date":"2026-03-29","type":"product_launch","value":"Magic Pointer rollout in Googlebook planned by Google DeepMind","source":"Google DeepMind Robotics"},{"date":"2026-02-01","type":"deployment","value":"Cumulative laser saw shipments exceed 4,000","source":"DISCO news release"}],"peers":[{"name":"Ibiden","rank":40,"slug":"ibiden","score":"91"},{"name":"ASE Technology Holding","rank":42,"slug":"ase-technology-holding","score":"91"},{"name":"Besi","rank":52,"slug":"besi","score":"90"},{"name":"Ajinomoto Fine-Techno","rank":64,"slug":"ajinomoto-fine-techno","score":"88"},{"name":"Unimicron","rank":80,"slug":"unimicron","score":"86"},{"name":"Nittobo","rank":86,"slug":"nittobo","score":"85"}],"stage":null,"state":"Tokyo","aliases":["6146.T","DISCO Corporation","ディスコ"],"country":"Japan","domains":[{"why":"DISCO supplies semiconductor manufacturing equipment, including grinders, laser saws and singulation systems used in wafer processing and AI chip production.","list":"AI Infra 100","rank":14,"tier":"member","layer":"Fabrication, memory & packaging","total":96,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":10,"position":10,"progress":8,"firepower":10,"commercial":10,"deployment":10,"production":8,"technology":10},"edition":"November 2026","segment":"Advanced packaging"}],"founded":null,"signals":[{"date":"2026-10-30","header":"SK hynix held its first Japan Partners Day to strengthen semiconductor technology and supply-chain cooperation.","outlet":"ZDNet Korea"},{"date":"2026-08-05","header":"L3Harris demonstrated AI-enabled electronic warfare using the Deceptor payload, DiSCO ecosystem, and KHA K1000 unmanned aerial systems.","outlet":"L3Harris"},{"date":"2026-07-15","header":"L3Harris Technologies and Shield AI completed the first live flight test of autonomous electronic warfare using DiSCO and Hivemind.","outlet":"L3Harris"},{"date":"2026-07-14","header":"DISCO and Tokyo Seimitsu are expanding semiconductor singulation capabilities.","outlet":"Electronics Weekly"},{"date":"2026-03-29","header":"Google DeepMind plans to roll out Magic Pointer in Googlebook.","outlet":"Google DeepMind Robotics"}],"website":"disco.co.jp","category":"AI Infra · Semiconductor equipment, materials & critical inputs","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-31T10:00:57.338+00:00","facts_total":5,"positioning":"The near-monopoly (60-80% share) in wafer dicing and grinding equipment and blades; the tools that thin wafers to the 30-50 micron levels HBM stacking requires, which makes it a gating step in the HBM and advanced-packaging chain.","sub_category":null,"signals_total":5,"url":"https://www.frontiertechintelligence.com/companies/disco","title":"Disco · ai core, Tokyo, Tokyo, Japan · scores, facts and signals · Frontier Tech Intelligence","description":"DISCO supplies semiconductor manufacturing equipment, including grinders, laser saws and singulation systems used in wafer processing and AI chip production. AI Infra 100 rank 14 (score 96) 5 signals and 5 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}