{"city":null,"name":"Extropic","slug":"extropic","facts":[{"date":"2026-09-04","type":"product_launch","value":"Z1T sparse-transformer models for Z1 announced","source":"Extropic announcement via explainx"},{"date":"2026-08-01","type":"product_launch","value":"Torx framework, Thermalizers compiler, and Z1 chip shipped as a full stack","source":"Untapped Ventures"},{"date":"2026-07-30","type":"contract","value":"Letter of intent with the US Department of Commerce CHIPS R&D Office to scale Z1 clusters and fabricate Z1.5 at a US foundry","source":"Extropic release, PR Newswire"},{"date":null,"type":"revenue_band","value":"pre-revenue","source":"Medium review, Extropic"},{"date":null,"type":"customer","value":"Weather and research customers","source":"Medium review, Extropic"},{"date":null,"type":"deployment","value":"XTR-0 development kits shipped to weather and research customers","source":"Medium review, Extropic"}],"peers":[],"stage":null,"state":null,"aliases":["Extropic AI","TSU","Thermodynamic Sampling Unit","Z1","X0"],"country":"United States","domains":[{"why":"Extropic develops probabilistic chips based on energy-based models and probabilistic bits, including its Z1 chip. It has shipped the Z1 as part of a full-stack computing platform and is pursuing Z1.5 fabrication.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":50,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":6,"position":4,"progress":8,"firepower":6,"commercial":3,"deployment":2,"production":4,"technology":6},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-07-29","header":"Extropic plans to fabricate a Z1.5 thermodynamic chip at a U.S. foundry using mature semiconductor process nodes.","outlet":"The AI Insider"},{"date":"2026-07-29","header":"Extropic signed a non-binding letter of intent with the U.S. Department of Commerce for up to $75 million in CHIPS R&D funding.","outlet":"The AI Insider"},{"date":"2026-07-29","header":"Extropic plans to scale its Z1 thermodynamic processor and build rack-scale computing systems.","outlet":"The AI Insider"},{"date":"2026-07-29","header":"Extropic plans to use Z1 clusters to benchmark thermodynamic AI algorithms at scales impractical to simulate on GPUs.","outlet":"The AI Insider"},{"date":"2026-07-15","header":"Extropic is building probabilistic chips based on energy-based models and probabilistic bits.","outlet":"EE Times"},{"date":"2026-07-03","header":"Extropic Corp. and the Massachusetts Institute of Technology simulated GPU-comparable image generation with an estimated 10,000-fold energy reduction.","outlet":"The AI Insider"}],"website":"extropic.ai","category":"AI Infra · Chips & accelerators","categories":[{"name":"Novel electronic architectures","domain":"AI Core","parent":"AI Infra · Chips & accelerators"}],"last_round":null,"updated_at":"2026-09-22T22:21:03.176+00:00","facts_total":11,"positioning":"Thermodynamic-computing chip company (Guillaume Verdon, ex-Google quantum; Trevor McCourt, ex-X and AWS) building Thermodynamic Sampling Units that use transistor noise as the computation; X0 proven at two fabs, Z1 production chip and full software stack shipped in 2026, with a US Department of Commerce CHIPS letter of intent to onshore Z1.5. A new compute substrate, not a GPU competitor at scale yet.","sub_category":"Novel electronic architectures","signals_total":9,"url":"https://www.frontiertechintelligence.com/companies/extropic","title":"Extropic · ai core, United States · scores, facts and signals · Frontier Tech Intelligence","description":"Extropic develops probabilistic chips based on energy-based models and probabilistic bits, including its Z1 chip. It has shipped the Z1 as part of a full-stack computing platform and is pursuing Z1.5 fabrication. AI Core watchlist (score 50) 9 signals and 11 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}