{"city":"Incheon","name":"Hanmi Semiconductor","slug":"hanmi-semiconductor","facts":[{"date":"2026-06-01","type":"revenue_band","value":"100-500m","source":"Exoswan citing company disclosure"},{"date":"2026-06-01","type":"customer","value":"SK hynix","source":"Exoswan citing company disclosure"},{"date":"2026-06-01","type":"contract","value":"KRW 44200000000","source":"Exoswan citing company disclosure"},{"date":"2026-06-01","type":"partnership","value":"SK hynix","source":"Exoswan citing company disclosure"}],"peers":[],"stage":null,"state":"Incheon","aliases":["Hanmi","TC Bonder Griffin","한미반도체"],"country":"South Korea","domains":[{"why":"Hanmi Semiconductor supplies back-end chip equipment, including TC Bonder Griffin thermocompression bonders used in HBM packaging, with SK hynix as a partner.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":78,"domain":"AI Core","scores":{"gate_ne":["technology","firepower"],"leverage":10,"position":8,"progress":8,"firepower":6,"commercial":6,"deployment":8,"production":8,"technology":8},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-10-30","header":"Hanmi Semiconductor reported strong year-on-year Q3 growth despite a sequential decline.","outlet":"The Elec"},{"date":"2026-10-06","header":"Hanmi Semiconductor won an $18.1 million Samsung contract for AI substrates.","outlet":"Tech in Asia"},{"date":"2026-07-14","header":"Hanwha, K&S, and BESI are increasing their exposure to HBM and advanced logic packaging.","outlet":"Electronics Weekly"}],"website":"hanmisemi.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-31T10:00:55.737+00:00","facts_total":4,"positioning":"The Korean thermo-compression bonder specialist behind SK hynix's HBM stacking; the cleanest single-company exposure to the HBM packaging bottleneck.","sub_category":"Advanced packaging","signals_total":3,"url":"https://www.frontiertechintelligence.com/companies/hanmi-semiconductor","title":"Hanmi Semiconductor · ai core, Incheon, Incheon, South Korea · scores, facts and signals · Frontier Tech Intelligence","description":"Hanmi Semiconductor supplies back-end chip equipment, including TC Bonder Griffin thermocompression bonders used in HBM packaging, with SK hynix as a partner. AI Core watchlist (score 78) 3 signals and 4 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}