{"city":"Ogaki","name":"Ibiden","slug":"ibiden","facts":[{"date":"2026-08-04","type":"setback","value":"ABF film not secured for upside","source":"Ibiden Q1 release via Envalith, I-Connect007, Nikhs"},{"date":"2026-08-04","type":"revenue","value":"26.4","source":"Ibiden Q1 release via Envalith, I-Connect007, Nikhs"},{"date":"2026-02-03","type":"deployment","value":"JPY 500000000000","source":"Ibiden interim report"},{"date":null,"type":"revenue_band","value":">500m","source":""}],"peers":[{"name":"Disco","rank":14,"slug":"disco","score":"96"},{"name":"ASE Technology Holding","rank":42,"slug":"ase-technology-holding","score":"91"},{"name":"Besi","rank":52,"slug":"besi","score":"90"},{"name":"Ajinomoto Fine-Techno","rank":64,"slug":"ajinomoto-fine-techno","score":"88"},{"name":"Unimicron","rank":80,"slug":"unimicron","score":"86"},{"name":"Nittobo","rank":86,"slug":"nittobo","score":"85"}],"stage":null,"state":"Gifu","aliases":["4062.T","IBIDEN","イビデン"],"country":"Japan","domains":[{"why":"Ibiden manufactures IC package substrates, including ABF-based substrates used in advanced semiconductor packaging for high-performance processors.","list":"AI Infra 100","rank":40,"tier":"member","layer":"Fabrication, memory & packaging","total":91,"domain":"AI Core","scores":{"gate_ne":["technology","firepower"],"leverage":10,"position":10,"progress":10,"firepower":8,"commercial":10,"deployment":10,"production":8,"technology":8},"edition":"November 2026","segment":"Advanced packaging"}],"founded":null,"signals":[{"date":"2026-10-30","header":"Ibiden plans a KRW 1.28 trillion investment to expand AI-server CPU substrate capacity","outlet":"The Elec"},{"date":"2026-10-21","header":"Nvidia is expanding AI infrastructure manufacturing capacity with six supply-chain partners.","outlet":"Yicai"},{"date":"2026-07-24","header":"ASE, PTI, Amkor, TSMC, SK hynix, Ibiden, and Unimicron are expanding advanced-packaging capacity.","outlet":"Electronics Weekly"},{"date":"2026-05-26","header":"Ibiden will invest approximately ¥500 billion over three years to expand high-performance IC package substrate capacity.","outlet":"Automation News Japan"},{"date":"2026-05-26","header":"Ibiden will make an initial ¥220 billion investment in Japanese and overseas facilities, with production starting from fiscal 2027.","outlet":"Automation News Japan"}],"website":"ibiden.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-31T10:00:56.869+00:00","facts_total":4,"positioning":"The leading maker of high-end IC package substrates under GPUs and AI CPUs; demand outpaces supply, and its own constraint is ABF film from a single supplier, which makes it the substrate bottleneck in company form.","sub_category":"Advanced packaging","signals_total":5,"url":"https://www.frontiertechintelligence.com/companies/ibiden","title":"Ibiden · ai core, Ogaki, Gifu, Japan · scores, facts and signals · Frontier Tech Intelligence","description":"Ibiden manufactures IC package substrates, including ABF-based substrates used in advanced semiconductor packaging for high-performance processors. AI Infra 100 rank 40 (score 91) 5 signals and 4 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}