{"city":"Boise","name":"Micron","slug":"micron","facts":[{"date":"2026-09-16","type":"revenue_band","value":">500m","source":"feeds.cms.handelsblatt.com — 2026-09-16"},{"date":"2026-09-10","type":"contract","value":"Micron is offering long-term memory supply deals to reduce buyers’ exposure to price swings","source":"The Register"},{"date":"2026-08-28","type":"product_launch","value":"Celebrated first Manassas apprenticeship graduates","source":"Micron"},{"date":"2026-08-26","type":"revenue","value":"USD 26400000000","source":"Electronics Weekly"},{"date":"2026-08-26","type":"partnership","value":"Formed a supplier consortium with CG Semi and Kaynes for India’s semiconductor packaging ecosystem","source":"EE Times"},{"date":"2026-08-26","type":"senior_hire","value":"Announced leadership appointments to accelerate innovation and growth","source":"Micron"}],"peers":[{"name":"SK hynix","rank":4,"slug":"sk-hynix","score":"100"}],"stage":null,"state":"Idaho","aliases":["EIM","Micron Technology","MU"],"country":"United States","domains":[{"why":"Micron designs and manufactures DRAM and high-bandwidth memory, including HBM4, HBM4E and server DDR5, used in AI and data-center systems.","list":"AI Infra 100","rank":50,"tier":"member","layer":"Fabrication, memory & packaging","total":90,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":10,"position":8,"progress":10,"firepower":10,"commercial":10,"deployment":8,"production":10,"technology":8},"edition":"November 2026","segment":"HBM & DRAM"}],"founded":null,"signals":[{"date":"2026-10-31","header":"Micron Technology will stay on 6F² DRAM and develop 3D DRAM rather than adopt 4F².","outlet":"Yicai"},{"date":"2026-10-30","header":"Micron offers Taiwan fab employees bonuses worth up to five times annual pay.","outlet":"Golem"},{"date":"2026-10-28","header":"Micron and other memory suppliers have remained capacity-constrained while expanding slowly.","outlet":"Peter H. Diamandis"},{"date":"2026-10-23","header":"U.S. semiconductor stocks rebounded on October 23, 2026.","outlet":"Yicai"},{"date":"2026-10-23","header":"Micron Technology shifted its memory strategy toward HBM products for generative AI workloads.","outlet":"Caixin"},{"date":"2026-10-23","header":"Micron Technology broke ground on a new semiconductor manufacturing facility in Clay, New York.","outlet":"Caixin"}],"website":"micron.com","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"HBM & DRAM","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-11-01T11:00:55.864+00:00","facts_total":31,"positioning":"The only US-based HBM and DRAM maker; third in HBM share but first to volume on HBM4 for the lead platform, with greenfield fabs in Idaho, New York and Taiwan ramping 2027-28; the memory supplier of record for the US sovereign case.","sub_category":"HBM & DRAM","signals_total":206,"url":"https://www.frontiertechintelligence.com/companies/micron","title":"Micron · ai core, Boise, Idaho, United States · scores, facts and signals · Frontier Tech Intelligence","description":"Micron designs and manufactures DRAM and high-bandwidth memory, including HBM4, HBM4E and server DDR5, used in AI and data-center systems. AI Infra 100 rank 50 (score 90) 206 signals and 31 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}