{"city":"Tokyo","name":"Nittobo","slug":"nittobo","facts":[{"date":"2026-05-12","type":"revenue_band","value":">500m","source":"Nittobo tanshin via BigGo, Nikkei"},{"date":"2026-05-12","type":"revenue","value":"FY3/27 guided revenue growth","source":"Nittobo tanshin via BigGo, Nikkei"},{"date":"2026-05-12","type":"revenue","value":"FY3/26 electronic materials revenue growth","source":"Nittobo tanshin via BigGo, Nikkei"},{"date":"2026-05-12","type":"revenue","value":"FY3/27 guided revenue growth (%)","source":"Nittobo tanshin via BigGo, Nikkei"},{"date":"2026-05-12","type":"revenue","value":"FY3/26 revenue growth (%)","source":"Nittobo tanshin via BigGo, Nikkei"},{"date":"2026-02-01","type":"deployment","value":"T-glass shortage persists into H2 2026, gating high-end ABF substrate supply (Unimicron)","source":"DigiTimes"}],"peers":[{"name":"Disco","rank":14,"slug":"disco","score":"96"},{"name":"Ibiden","rank":40,"slug":"ibiden","score":"91"},{"name":"ASE Technology Holding","rank":42,"slug":"ase-technology-holding","score":"91"},{"name":"Besi","rank":52,"slug":"besi","score":"90"},{"name":"Ajinomoto Fine-Techno","rank":64,"slug":"ajinomoto-fine-techno","score":"88"},{"name":"Unimicron","rank":80,"slug":"unimicron","score":"86"}],"stage":null,"state":"Tokyo","aliases":["3110.T","Nitto Boseki","T-glass","日東紡","日東紡績"],"country":"Japan","domains":[{"why":"Nittobo manufactures T-glass, a high-performance glass-fiber material used in high-end ABF semiconductor package substrates. Persistent T-glass shortages can directly constrain advanced packaging supply.","list":"AI Infra 100","rank":86,"tier":"member","layer":"Fabrication, memory & packaging","total":85,"domain":"AI Core","scores":{"gate_ne":["technology","firepower"],"leverage":10,"position":10,"progress":10,"firepower":6,"commercial":8,"deployment":10,"production":6,"technology":8},"edition":"November 2026","segment":"Advanced packaging"}],"founded":null,"signals":[{"date":"2026-07-24","header":"TSMC, Ajinomoto, and Nittobo occupy critical supply-chain positions for AI packaging.","outlet":"Electronics Weekly"}],"website":"nittobo.co.jp","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-10-25T23:18:47.108753+00:00","facts_total":7,"positioning":"The dominant maker of low-thermal-expansion T-glass cloth for AI package substrates and low-dielectric NE glass for data-center boards; a specialty-glass chokepoint whose shortage has been named by the substrate makers as gating high-end ABF supply.","sub_category":"Advanced packaging","signals_total":1,"url":"https://www.frontiertechintelligence.com/companies/nittobo","title":"Nittobo · ai core, Tokyo, Tokyo, Japan · scores, facts and signals · Frontier Tech Intelligence","description":"Nittobo manufactures T-glass, a high-performance glass-fiber material used in high-end ABF semiconductor package substrates. Persistent T-glass shortages can directly constrain advanced packaging supply. AI Infra 100 rank 86 (score 85) 1 signals and 7 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}