{"city":"Tokyo","name":"Resonac","slug":"resonac","facts":[{"date":"2026-09-17","type":"revenue_band","value":">500m","source":"rsshub.bkraju.com — 2026-09-17"},{"date":"2025-11-03","type":"partnership","value":"Soitec SmartSiC technology partnership; technology can reduce SiC substrate emissions by up to 80%","source":"Power Electronics News"},{"date":"2025-11-03","type":"partnership","value":"Resonac and Tohoku University completed basic research on a lower-impact SiC powder process","source":"Power Electronics News"},{"date":"2025-11-03","type":"partnership","value":"80","source":"Power Electronics News"},{"date":"2025-07-16","type":"partnership","value":"Resonac and Tohoku University began full-scale studies of SiC powder made from silicon sludge and carbon dioxide","source":"semiconductor-today.com"},{"date":"2024-09-25","type":"partnership","value":"Resonac and Soitec agreed to jointly develop 200mm bonded SiC substrates","source":"semiconductor-today.com"}],"peers":[{"name":"Shin-Etsu Chemical","rank":48,"slug":"shin-etsu-chemical","score":"90"}],"stage":null,"state":"Tokyo","aliases":["4004.T","Hitachi Chemical","Resonac Holdings","Showa Denko","レゾナック","レゾナック・ホールディングス"],"country":"Japan","domains":[{"why":"Resonac supplies semiconductor materials, including SiC wafers and SiC powder, to chipmakers such as Infineon.","list":"AI Infra 100","rank":78,"tier":"member","layer":"Semiconductor equipment, materials & critical inputs","total":86,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":8,"position":8,"progress":10,"firepower":8,"commercial":10,"deployment":10,"production":8,"technology":8},"edition":"November 2026","segment":"Wafers, chemicals & gases"}],"founded":null,"signals":[{"date":"2026-09-29","header":"Resonac plans to use 300mm SiC wafers to reduce power semiconductor costs","outlet":"Golem"},{"date":"2026-09-17","header":"Japanese semiconductor material giants invest in US AI hardware venture fund","outlet":"36Kr newsflashes"},{"date":"2026-08-17","header":"Resonac will expand hard-disk media capacity at Resonac HD Singapore by 31%.","outlet":"Automation News Japan"},{"date":"2026-05-22","header":"Resonac demonstrated 2/2µm damascene wiring on 320×320mm glass panels.","outlet":"Electronics Weekly"},{"date":"2025-11-03","header":"Soitec’s SmartSiC technology can reduce SiC substrate emissions by up to 80%.","outlet":"Power Electronics News"},{"date":"2025-11-03","header":"Resonac and Tohoku University completed basic research on a lower-impact SiC powder process.","outlet":"Power Electronics News"}],"website":"resonac.com","category":"AI Infra · Semiconductor equipment, materials & critical inputs","categories":[{"name":"Wafers, chemicals & gases","domain":"AI Core","parent":"AI Infra · Semiconductor equipment, materials & critical inputs"}],"last_round":null,"updated_at":"2026-10-25T23:18:47.108753+00:00","facts_total":21,"positioning":"Japan's back-end semiconductor materials leader (molding compounds, die-attach, non-conductive film, AI copper-clad laminate, thermal interface materials); AI-related volume up 1.5x in a quarter and CCL prices raised 30%, with petrochemicals spun off to concentrate on semiconductor materials.","sub_category":"Wafers, chemicals & gases","signals_total":13,"url":"https://www.frontiertechintelligence.com/companies/resonac","title":"Resonac · ai core, Tokyo, Tokyo, Japan · scores, facts and signals · Frontier Tech Intelligence","description":"Resonac supplies semiconductor materials, including SiC wafers and SiC powder, to chipmakers such as Infineon. AI Infra 100 rank 78 (score 86) 13 signals and 21 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}