{"city":"Kyoto","name":"ROHM","slug":"rohm","facts":[{"date":"2026-05-21","type":"deployment","value":"750","source":"rohm.co.jp"},{"date":"2026-05-21","type":"deployment","value":"ROHM's 750 V SiC MOSFET was adopted in a battery backup unit for AI server power supplies using HVDC architectures.","source":"rohm.co.jp"},{"date":"2026-03-31","type":"headcount","value":"21756","source":"rohm.com"},{"date":"2026-03-31","type":"revenue","value":"JPY 481148000000","source":"rohm.com"},{"date":"2026-02-26","type":"partnership","value":"ROHM and TSMC integrated ROHM's GaN device development and manufacturing technologies with TSMC's process technology to establish an end-to-end production system for applications including AI servers.","source":"rohm.com"},{"date":"2025-03-01","type":"product_launch","value":"AI-equipped MCUs capable of on-device learning and inference for equipment anomaly detection; sales began in March 2025.","source":"rohm.com"}],"peers":[],"stage":"public","state":"Kyoto","aliases":[],"country":"Japan","domains":[{"why":"ROHM develops and supplies silicon, SiC, and GaN power devices for AI data-center power infrastructure, including 800 V HVDC architectures and battery backup units for AI server power supplies.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":53,"domain":"AI Core","scores":{"gate_ne":["firepower"],"leverage":6,"position":7,"progress":8,"firepower":1,"commercial":10,"deployment":4,"production":10,"technology":3},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-10-27","header":"ROHM’s BM85060FV targets 99% system-level conversion efficiency and 150μA no-load consumption.","outlet":"ZDNet Korea"},{"date":"2026-10-27","header":"ROHM developed the BM85060FV GaN-optimized totem-pole PFC controller IC.","outlet":"ZDNet Korea"},{"date":"2026-10-07","header":"Infineon, STMicroelectronics, Wolfspeed, onsemi, ROHM, Mitsubishi Electric, Fuji Electric, Microchip, Toshiba, and Semikron Danfoss are listed as the top ten SiC producers.","outlet":"Electronics Weekly"},{"date":"2026-06-30","header":"ROHM launched the TSC3PAK top-side-cooling package for SiC MOSFETs.","outlet":"Power Electronics News"},{"date":"2026-06-30","header":"Oxford Instruments is supplying ROHM with 200 mm GaN plasma atomic layer etch technology.","outlet":"Power Electronics News"},{"date":"2026-06-30","header":"ROHM’s 750 V SiC MOSFET was adopted in an AI-server battery backup unit.","outlet":"Power Electronics News"}],"website":"https://www.rohm.com/","category":"AI Infra · Power, cooling & thermal","categories":[{"name":"Power semiconductors (GaN/SiC)","domain":"AI Core","parent":"AI Infra · Power, cooling & thermal"}],"last_round":null,"updated_at":"2026-10-27T10:00:58.551+00:00","facts_total":13,"positioning":"","sub_category":"Power semiconductors (GaN/SiC)","signals_total":37,"url":"https://www.frontiertechintelligence.com/companies/rohm","title":"ROHM · ai core, Kyoto, Kyoto, Japan · scores, facts and signals · Frontier Tech Intelligence","description":"ROHM develops and supplies silicon, SiC, and GaN power devices for AI data-center power infrastructure, including 800 V HVDC architectures and battery backup units for AI server power supplies. AI Core watchlist (score 53) 37 signals and 13 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}