{"city":"Suwon","name":"Samsung Electro-Mechanics","slug":"samsung-electro-mechanics","facts":[{"date":"2026-09-01","type":"contract","value":"AI-server MLCC supply contract with a major global company, covering January through December 2027.","source":"sem.samsung.com"},{"date":"2025-12-31","type":"ownership_change","value":"Samsung Electronics Co., Ltd. holds 23.7% and is the largest shareholder.","source":"sem.samsung.co.kr"},{"date":"2025-12-31","type":"headcount","value":"36490","source":"sem.samsung.com"},{"date":"2025-12-31","type":"revenue","value":"KRW 11314500000000","source":"samsungsem.com"},{"date":"2025-05-21","type":"product_launch","value":"Developed AI-server MLCCs CL05X476MS6N9W# and CL10X107MS8NZW#.","source":"product.samsungsem.com"},{"date":"2024-07-22","type":"customer","value":"AMD is a customer for Samsung Electro-Mechanics' high-performance HPC server FCBGA substrates.","source":"sem.samsung.com"}],"peers":[],"stage":"public","state":"Gyeonggi","aliases":[],"country":"South Korea","domains":[{"why":"Samsung Electro-Mechanics sells high-performance FCBGA package substrates to HPC and hyperscale data-center customers, including AMD, for AI-server semiconductor packaging.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":43,"domain":"AI Core","scores":{"gate_ne":["technology","firepower"],"leverage":7,"position":5,"progress":8,"firepower":1,"commercial":10,"deployment":1,"production":10,"technology":1},"edition":null,"segment":null},{"why":"Samsung Electro-Mechanics sells ADAS and autonomous-driving camera modules to automotive OEMs and Tier 1 suppliers.","list":null,"rank":null,"tier":"watchlist","layer":null,"total":42,"domain":"Robotics","scores":{"gate_ne":["technology","firepower"],"leverage":7,"position":5,"progress":7,"firepower":1,"commercial":10,"deployment":1,"production":10,"technology":1},"edition":null,"segment":null}],"founded":null,"signals":[{"date":"2026-10-30","header":"Samsung Electro-Mechanics signed a KRW 879.3 billion MLCC supply contract for AI servers.","outlet":"ZDNet Korea"},{"date":"2026-10-28","header":"Samsung Electro-Mechanics reported a 165% year-over-year increase in third-quarter profit.","outlet":"Tech in Asia"},{"date":"2026-10-22","header":"Samsung Electro-Mechanics and Nvidia will jointly invest in dedicated AI semiconductor package-substrate facilities.","outlet":"The Elec"},{"date":"2026-10-21","header":"Nvidia is expanding AI infrastructure manufacturing capacity with six supply-chain partners.","outlet":"Yicai"},{"date":"2026-10-20","header":"Samsung Electro-Mechanics signed a 360.5 billion won package-substrate supply contract for memory semiconductors.","outlet":"The Elec"},{"date":"2026-10-07","header":"Samsung Electro-Mechanics plans nearly $5 billion to expand FC-BGA semiconductor-substrate production in South Korea and Vietnam.","outlet":"36Kr newsflashes"}],"website":"https://www.samsungsem.com/global/index.do","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"},{"name":"Robotics · Sensing","domain":"Robotics","parent":null}],"last_round":null,"updated_at":"2026-10-31T10:00:57.399+00:00","facts_total":8,"positioning":"","sub_category":null,"signals_total":14,"url":"https://www.frontiertechintelligence.com/companies/samsung-electro-mechanics","title":"Samsung Electro-Mechanics · ai core, Suwon, Gyeonggi, South Korea · scores, facts and signals · Frontier Tech Intelligence","description":"Samsung Electro-Mechanics sells high-performance FCBGA package substrates to HPC and hyperscale data-center customers, including AMD, for AI-server semiconductor packaging. AI Core watchlist (score 43) 14 signals and 8 facts with sources.","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}