Shinko Electric manufactures semiconductor packages and package substrates, including flip-chip and other advanced IC packaging products used to assemble and connect semiconductor devices.
Discovered 2026-09-07 during AI Core loading: Substrates; Japan, new fab with government support
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Shinko Electric manufactures semiconductor packages and package substrates, including flip-chip and other advanced IC packaging products used to assemble and connect semiconductor devices. Discovered 2026-09-07 during AI Core loading: Substrates; Japan, new fab with government support
Shinko Electric is on the AI Core prospect list of Frontier Tech Intelligence with a score of 20 out of 100, below the Top 100.
Shinko Electric is based in Nagano, Nagano, Japan.
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