{"city":"Nagano","name":"Shinko Electric","slug":"shinko-electric","facts":[{"date":null,"type":"revenue_band","value":"unknown","source":""},{"date":null,"type":"ownership_change","value":"Japan Investment Corporation consortium","source":""}],"peers":[],"stage":null,"state":"Nagano","aliases":[],"country":"Japan","domains":[{"why":"Shinko Electric manufactures semiconductor packages and package substrates, including flip-chip and other advanced IC packaging products used to assemble and connect semiconductor devices.","list":null,"rank":null,"tier":"prospect","layer":null,"total":20,"domain":"AI Core","scores":{"gate_ne":["technology","firepower"],"leverage":2,"position":2,"progress":2,"firepower":2,"commercial":2,"deployment":2,"production":2,"technology":2},"edition":null,"segment":null}],"founded":null,"signals":[],"website":"shinko.co.jp","category":"AI Infra · Fabrication, memory & packaging","categories":[{"name":"Advanced packaging","domain":"AI Core","parent":"AI Infra · Fabrication, memory & packaging"}],"last_round":null,"updated_at":"2026-09-22T22:24:54.742+00:00","facts_total":2,"positioning":"Discovered 2026-09-07 during AI Core loading: Substrates; Japan, new fab with government support","sub_category":"Advanced packaging","signals_total":0,"url":"https://www.frontiertechintelligence.com/companies/shinko-electric","title":"Shinko Electric · ai core, Nagano, Nagano, Japan · scores, facts and signals · Frontier Tech Intelligence","description":"Shinko Electric manufactures semiconductor packages and package substrates, including flip-chip and other advanced IC packaging products used to assemble and connect semiconductor devices. AI Core prospect (score 20)","publisher":"Frontier Tech Intelligence (Future Frontiers, a trade name of Essential Cognition Inc.)","note":"Assessment by Frontier Tech Intelligence; facts and signals carry their sources."}