{"list":"AI Infra 100","list_slug":"ai-infra","facet":"category","value":"Fabrication, memory & packaging","edition":"November 2026","published_at":"2026-11-01T13:18:02.499959+00:00","count":12,"of":100,"url":"https://www.frontiertechintelligence.com/leaders/ai-infra/category/fabrication-memory-packaging","members":[{"rank":4,"name":"SK hynix","url":"https://www.frontiertechintelligence.com/companies/sk-hynix","category":"Fabrication, memory & packaging","segment":"HBM & DRAM","country":"South Korea","score":100,"positioning":"SK hynix is a major memory-chip manufacturer producing HBM, DRAM and NAND flash, including HBM4 mass shipments and planned HBM4E production. It is also expanding advanced-packaging capacity for AI memory products."},{"rank":6,"name":"TSMC","url":"https://www.frontiertechintelligence.com/companies/tsmc","category":"Fabrication, memory & packaging","segment":"Foundry","country":"Taiwan","score":100,"positioning":"TSMC is a leading semiconductor foundry that manufactures advanced logic chips for customers including Apple, Nvidia, MediaTek and Xiaomi across leading-edge process nodes."},{"rank":14,"name":"Disco","url":"https://www.frontiertechintelligence.com/companies/disco","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Japan","score":96,"positioning":"DISCO supplies semiconductor manufacturing equipment, including grinders, laser saws and singulation systems used in wafer processing and AI chip production."},{"rank":30,"name":"Tower Semiconductor","url":"https://www.frontiertechintelligence.com/companies/tower-semiconductor","category":"Fabrication, memory & packaging","segment":"Photonic foundry & PIC platforms","country":"Israel","score":94,"positioning":"Tower Semiconductor runs specialty foundries that make silicon-photonic platforms, photonic integrated circuits and optical components for communications and AI infrastructure."},{"rank":33,"name":"Samsung Electronics","url":"https://www.frontiertechintelligence.com/companies/samsung-electronics","category":"Fabrication, memory & packaging","segment":"Foundry","country":"South Korea","score":93,"positioning":"Samsung Electronics makes chips as a foundry, including AI accelerators for Rebellions, Tenstorrent, Groq and Tesla, and produces HBM4 memory and advanced packaging."},{"rank":40,"name":"Ibiden","url":"https://www.frontiertechintelligence.com/companies/ibiden","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Japan","score":91,"positioning":"Ibiden manufactures IC package substrates, including ABF-based substrates used in advanced semiconductor packaging for high-performance processors."},{"rank":42,"name":"ASE Technology Holding","url":"https://www.frontiertechintelligence.com/companies/ase-technology-holding","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Taiwan","score":91,"positioning":"ASE is a major semiconductor assembly and advanced-packaging provider, with FOCoS, FOCoS-Bridge, CoWoS, system-in-package and FC-BGA capabilities for AI and HPC applications."},{"rank":50,"name":"Micron","url":"https://www.frontiertechintelligence.com/companies/micron","category":"Fabrication, memory & packaging","segment":"HBM & DRAM","country":"United States","score":90,"positioning":"Micron designs and manufactures DRAM and high-bandwidth memory, including HBM4, HBM4E and server DDR5, used in AI and data-center systems."},{"rank":52,"name":"Besi","url":"https://www.frontiertechintelligence.com/companies/besi","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Netherlands","score":90,"positioning":"Besi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding."},{"rank":64,"name":"Ajinomoto Fine-Techno","url":"https://www.frontiertechintelligence.com/companies/ajinomoto-fine-techno","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Japan","score":88,"positioning":"Ajinomoto Fine-Techno supplies Ajinomoto Build-up Film (ABF), a key insulating material used in semiconductor package substrates and advanced chip packaging."},{"rank":80,"name":"Unimicron","url":"https://www.frontiertechintelligence.com/companies/unimicron","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Taiwan","score":86,"positioning":"Unimicron supplies high-end ABF substrates used by semiconductor and accelerator manufacturers in advanced packaging."},{"rank":86,"name":"Nittobo","url":"https://www.frontiertechintelligence.com/companies/nittobo","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Japan","score":85,"positioning":"Nittobo manufactures T-glass, a high-performance glass-fiber material used in high-end ABF semiconductor package substrates. Persistent T-glass shortages can directly constrain advanced packaging supply."}]}