{"list":"AI Infra 100","list_slug":"ai-infra","facet":"country","value":"Netherlands","edition":"November 2026","published_at":"2026-11-01T13:18:02.499959+00:00","count":3,"of":100,"url":"https://www.frontiertechintelligence.com/leaders/ai-infra/country/netherlands","members":[{"rank":3,"name":"ASML","url":"https://www.frontiertechintelligence.com/companies/asml","category":"Semiconductor equipment, materials & critical inputs","segment":"Lithography","country":"Netherlands","score":100,"positioning":"ASML designs and sells advanced semiconductor lithography systems, including EUV and High-NA EUV machines used by leading-edge logic and memory manufacturers."},{"rank":41,"name":"ASM International","url":"https://www.frontiertechintelligence.com/companies/asm-international","category":"Semiconductor equipment, materials & critical inputs","segment":"Deposition, etch & metrology","country":"Netherlands","score":91,"positioning":"ASM International supplies wafer-processing equipment, mainly atomic layer deposition (ALD) and epitaxy systems, for advanced logic and memory manufacturing."},{"rank":52,"name":"Besi","url":"https://www.frontiertechintelligence.com/companies/besi","category":"Fabrication, memory & packaging","segment":"Advanced packaging","country":"Netherlands","score":90,"positioning":"Besi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding."}]}