{"list":"AI Infra 100","list_slug":"ai-infra","facet":"country","value":"South Korea","edition":"November 2026","published_at":"2026-11-01T13:18:02.499959+00:00","count":3,"of":100,"url":"https://www.frontiertechintelligence.com/leaders/ai-infra/country/south-korea","members":[{"rank":4,"name":"SK hynix","url":"https://www.frontiertechintelligence.com/companies/sk-hynix","category":"Fabrication, memory & packaging","segment":"HBM & DRAM","country":"South Korea","score":100,"positioning":"SK hynix is a major memory-chip manufacturer producing HBM, DRAM and NAND flash, including HBM4 mass shipments and planned HBM4E production. It is also expanding advanced-packaging capacity for AI memory products."},{"rank":33,"name":"Samsung Electronics","url":"https://www.frontiertechintelligence.com/companies/samsung-electronics","category":"Fabrication, memory & packaging","segment":"Foundry","country":"South Korea","score":93,"positioning":"Samsung Electronics makes chips as a foundry, including AI accelerators for Rebellions, Tenstorrent, Groq and Tesla, and produces HBM4 memory and advanced packaging."},{"rank":68,"name":"LG Electronics","url":"https://www.frontiertechintelligence.com/companies/lg-electronics","category":"Power, cooling & thermal","segment":"Cooling & thermal","country":"South Korea","score":88,"positioning":"LG Electronics supplies data-center cooling, including coolant distribution units, liquid-immersion cooling and predictive cooling controls, for hyperscale and other data centers."}]}