Resonac supplies semiconductor materials, including SiC wafers and SiC powder, to chipmakers such as Infineon.
Japan's back-end semiconductor materials leader (molding compounds, die-attach, non-conductive film, AI copper-clad laminate, thermal interface materials); AI-related volume up 1.5x in a quarter and CCL prices raised 30%, with petrochemicals spun off to concentrate on semiconductor materials.
13 signals name Resonac. Members see all of them, filtered by topic, source and date.
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Traction: deployment, production, commercials, progress. Capability: technology, positioning, firepower, leverage.
The segment's suppliers, constraints and risers, for members.
Resonac supplies semiconductor materials, including SiC wafers and SiC powder, to chipmakers such as Infineon. Japan's back-end semiconductor materials leader (molding compounds, die-attach, non-conductive film, AI copper-clad laminate, thermal interface materials); AI-related volume up 1.5x in a quarter and CCL prices raised 30%, with petrochemicals spun off to concentrate on semiconductor materials.
Resonac ranks 78 of 100 on the AI Infra 100 (November 2026 edition) with a score of 86 out of 100, in Wafers, chemicals & gases (Semiconductor equipment, materials & critical inputs). Assessment by Frontier Tech Intelligence.
Shin-Etsu Chemical (rank 48).
Resonac is based in Tokyo, Tokyo, Japan.
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