Ajinomoto Fine-Techno supplies Ajinomoto Build-up Film (ABF), a key insulating material used in semiconductor package substrates and advanced chip packaging.
The sole supplier (about 95% share) of ABF build-up film, the insulating layer in every high-end GPU, CPU and ASIC package substrate; a specialty-chemicals unit of a food company that gates the substrate layer, with no new capacity before 2028.
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Ajinomoto Fine-Techno supplies Ajinomoto Build-up Film (ABF), a key insulating material used in semiconductor package substrates and advanced chip packaging. The sole supplier (about 95% share) of ABF build-up film, the insulating layer in every high-end GPU, CPU and ASIC package substrate; a specialty-chemicals unit of a food company that gates the substrate layer, with no new capacity before 2028.
Ajinomoto Fine-Techno ranks 64 of 100 on the AI Infra 100 (November 2026 edition) with a score of 88 out of 100, in Advanced packaging (Fabrication, memory & packaging). Assessment by Frontier Tech Intelligence.
Disco (rank 14), Ibiden (rank 40), ASE Technology Holding (rank 42), Besi (rank 52), Unimicron (rank 80), Nittobo (rank 86).
Ajinomoto Fine-Techno is based in Kawasaki, Kanagawa, Japan.
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