Besi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding.
The most accurate hybrid-bonding tool maker and a leading assembly-equipment supplier; the equipment bet on HBM4E and co-packaged optics adopting hybrid bonding, with Applied Materials as line partner.
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Besi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding. The most accurate hybrid-bonding tool maker and a leading assembly-equipment supplier; the equipment bet on HBM4E and co-packaged optics adopting hybrid bonding, with Applied Materials as line partner.
Besi ranks 52 of 100 on the AI Infra 100 (November 2026 edition) with a score of 90 out of 100, in Advanced packaging (Fabrication, memory & packaging). Assessment by Frontier Tech Intelligence.
Disco (rank 14), Ibiden (rank 40), ASE Technology Holding (rank 42), Ajinomoto Fine-Techno (rank 64), Unimicron (rank 80), Nittobo (rank 86).
Besi is based in Duiven, Gelderland, Netherlands.
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