Ibiden manufactures IC package substrates, including ABF-based substrates used in advanced semiconductor packaging for high-performance processors.
The leading maker of high-end IC package substrates under GPUs and AI CPUs; demand outpaces supply, and its own constraint is ABF film from a single supplier, which makes it the substrate bottleneck in company form.
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Ibiden manufactures IC package substrates, including ABF-based substrates used in advanced semiconductor packaging for high-performance processors. The leading maker of high-end IC package substrates under GPUs and AI CPUs; demand outpaces supply, and its own constraint is ABF film from a single supplier, which makes it the substrate bottleneck in company form.
Ibiden ranks 40 of 100 on the AI Infra 100 (November 2026 edition) with a score of 91 out of 100, in Advanced packaging (Fabrication, memory & packaging). Assessment by Frontier Tech Intelligence.
Disco (rank 14), ASE Technology Holding (rank 42), Besi (rank 52), Ajinomoto Fine-Techno (rank 64), Unimicron (rank 80), Nittobo (rank 86).
Ibiden is based in Ogaki, Gifu, Japan.
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