12 of the 100 companies on the AI Infra 100 are in the Fabrication, memory & packaging category (12% of the list), in 4 segments and from 6 countries. The highest ranked is SK hynix, rank 4 of 100 with a score of 100. Ranking and scores from the November 2026 edition, the assessment by Frontier Tech Intelligence of the AI infrastructure landscape.
| Rank | Company | Category / segment | Country | Score |
|---|---|---|---|---|
| 4 | SK hynixSK hynix is a major memory-chip manufacturer producing HBM, DRAM and NAND flash, including HBM4 mass shipments and planned HBM4E production. It is also expanding advanced-packaging capacity for AI memory products. | Fabrication, memory & packaging / HBM & DRAM | South Korea | 100 |
| 6 | TSMCTSMC is a leading semiconductor foundry that manufactures advanced logic chips for customers including Apple, Nvidia, MediaTek and Xiaomi across leading-edge process nodes. | Fabrication, memory & packaging / Foundry | Taiwan | 100 |
| 14 | DiscoDISCO supplies semiconductor manufacturing equipment, including grinders, laser saws and singulation systems used in wafer processing and AI chip production. | Fabrication, memory & packaging / Advanced packaging | Japan | 96 |
| 30 | Tower SemiconductorTower Semiconductor runs specialty foundries that make silicon-photonic platforms, photonic integrated circuits and optical components for communications and AI infrastructure. | Fabrication, memory & packaging / Photonic foundry & PIC platforms | Israel | 94 |
| 33 | Samsung ElectronicsSamsung Electronics makes chips as a foundry, including AI accelerators for Rebellions, Tenstorrent, Groq and Tesla, and produces HBM4 memory and advanced packaging. | Fabrication, memory & packaging / Foundry | South Korea | 93 |
| 40 | IbidenIbiden manufactures IC package substrates, including ABF-based substrates used in advanced semiconductor packaging for high-performance processors. | Fabrication, memory & packaging / Advanced packaging | Japan | 91 |
| 42 | ASE Technology HoldingASE is a major semiconductor assembly and advanced-packaging provider, with FOCoS, FOCoS-Bridge, CoWoS, system-in-package and FC-BGA capabilities for AI and HPC applications. | Fabrication, memory & packaging / Advanced packaging | Taiwan | 91 |
| 50 | MicronMicron designs and manufactures DRAM and high-bandwidth memory, including HBM4, HBM4E and server DDR5, used in AI and data-center systems. | Fabrication, memory & packaging / HBM & DRAM | United States | 90 |
| 52 | BesiBesi sells semiconductor assembly and advanced-packaging equipment, including the Datacon 8800 CHAMEO ultra plus hybrid-bonding system for die-to-wafer bonding. | Fabrication, memory & packaging / Advanced packaging | Netherlands | 90 |
| 64 | Ajinomoto Fine-TechnoAjinomoto Fine-Techno supplies Ajinomoto Build-up Film (ABF), a key insulating material used in semiconductor package substrates and advanced chip packaging. | Fabrication, memory & packaging / Advanced packaging | Japan | 88 |
| 80 | UnimicronUnimicron supplies high-end ABF substrates used by semiconductor and accelerator manufacturers in advanced packaging. | Fabrication, memory & packaging / Advanced packaging | Taiwan | 86 |
| 86 | NittoboNittobo manufactures T-glass, a high-performance glass-fiber material used in high-end ABF semiconductor package substrates. Persistent T-glass shortages can directly constrain advanced packaging supply. | Fabrication, memory & packaging / Advanced packaging | Japan | 85 |
Score out of 100: traction (deployment, production, commercials, progress) and capability (technology, positioning, firepower, leverage). The full AI Infra 100 with filters →
SK hynix ranks highest (rank 4 of 100, score 100). The Fabrication, memory & packaging category holds 12 of the 100 companies on the AI Infra 100: SK hynix, TSMC, Disco, Tower Semiconductor and Samsung Electronics and 7 more. Ranking from the AI Infra 100, November 2026 edition, by Frontier Tech Intelligence.
SK hynix, TSMC, Disco, Tower Semiconductor and Samsung Electronics and 7 more. Ranking from the AI Infra 100, November 2026 edition, by Frontier Tech Intelligence.
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